Systems and methods for providing a dynamically modular processing unit

ABSTRACT

Systems and methods for providing a dynamically modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an enterprise. In some implementations, a modular processing unit includes a non-peripheral based encasement, a cooling process (e.g., a thermodynamic convection cooling process, a forced air cooling process, and/or a liquid cooling process), an optimized circuit board configuration, optimized processing and memory ratios, and a dynamic back plane that provides increased flexibility and support to peripherals and applications. The modular processing unit is customizable and may be employed in association with all types of computer enterprises. The platform allows for a plethora of modifications that may be made with minimal impact to the dynamically modular unit, thereby enhancing the usefulness of the platform across all type of application.

RELATED APPLICATIONS

This is a divisional application of U.S. patent application Ser. No.10/691,114 filed Oct. 22, 2003, entitled SYSTEMS AND METHODS FORPROVIDING A DYNAMICALLY MODULAR PROCESSING UNIT, which claims priorityto U.S. Provisional Patent Application Ser. No. 60/420,127 filed Oct.22, 2002 entitled NON-PERIPHERALS PROCESSING CONTROL UNIT HAVINGIMPROVED HEAT DISSIPATING PROPERTIES and to U.S. Provisional PatentApplication Ser. No. 60/455,789 filed Mar. 19, 2003 entitled SYSTEMS ANDMETHODS FOR PROVIDING A DURABLE AND DYNAMICALLY MODULAR PROCESSING UNIT,which are incorporated herein by reference, and is related to co-pendingU.S. patent application Ser. No. 10/691,473 filed Oct. 22, 2003,entitled NON-PERIPHERALS PROCESSING CONTROL MODULE HAVING IMPROVED HEATDISSIPATING PROPERTIES, and to co-pending U.S. patent application Ser.No. 10/692,005 filed Oct. 22, 2003, entitled ROBUST CUSTOMIZABLECOMPUTER PROCESSING SYSTEM, which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to systems and methods for providing adynamically modular processing unit. In particular, the presentinvention relates to providing a modular processing unit that isconfigured to be selectively used alone or with similar processing unitsin an enterprise. In some implementations, each modular processing unitincludes a non-peripheral based encasement, a cooling process (e.g.,thermodynamic convection cooling, forced air, and/or liquid cooling), anoptimized circuit board configuration, optimized processing and memoryratios, and a dynamic back plane that provides increased flexibility andsupport to peripherals and applications.

2. Background and Related Art

Technological advancements have occurred over the years with respect tocomputer related technologies. For example, computer systems onceemployed vacuum tubes. The tubes were replaced with transistors.Magnetic cores were used for memory. Thereafter, punch cards andmagnetic tapes were commonly employed. Integrated circuits and operatingsystems were introduced. Today, microprocessor chips are currently usedin computer systems.

The evolution of computer related technologies has included thedevelopment of various form factors in the computer industry. One suchstandard form factor was referred to as Advanced Technology (“AT”),which ran considerably faster than prior systems and included a newkeyboard, an 80286 processor, a floppy drive that had a higher-capacity(1.2 MB) than prior systems and a 16-bit data bus.

Over time, improvements were made to the AT form factor that included achange in the orientation of the motherboard. The improvements allowedfor a more efficient design of the motherboard by locating disk driveconnectors closer to drive bays and the central processing unit closerto the power supply and cooling fan. The new location of the centralprocessing unit allowed the expansion slots to all hold full-lengthadd-in cards.

While the developments increased the processing ability, the techniqueshave only been marginally effective in their ability to upgradecomponents as the computer technology advances. In fact, the techniqueshave become increasingly less desirable as a delivery mechanism forcomputer technologies. Predictable failure patterns have been identifiedin terms of operating durability, manufacturing, shipping, and support.The systems generate heat, which requires internal cooling systems thatare noisy. Moreover, current computer systems are prone to requiringrepair.

Thus, while computer technologies currently exist that are configuredfor use in processing data, challenges still exist. Accordingly, itwould be an improvement in the art to augment or even replace currenttechniques with other techniques.

SUMMARY OF THE INVENTION

The present invention relates to systems and methods for providing adynamically modular processing unit. In particular, implementation ofthe present invention takes place in association with a modularprocessing unit that is lightweight, compact, and is configured to beselectively used alone or with similar processing units in anenterprise. In some implementations, each modular processing unitincludes a non-peripheral based encasement, a cooling process (e.g.,thermodynamic convection cooling, forced air, and/or liquid cooling), anoptimized circuit board configuration, optimized processing and memoryratios, and a dynamic back plane that provides increased flexibility andsupport to peripherals and applications.

In one implementation, a dynamically modular processing unit is a cubeplatform (e.g., a 3½-inch (8.9 cm) cube platform or another size and/orconfiguration) that utilizes an advanced cooling process (e.g., athermodynamic cooling model that eliminates any need for a cooling fan,a forced air cooling process and/or a liquid cooling process). The unitalso includes a layered motherboard configuration, and optimizedprocessing and memory ratios. The bus architecture of the unit enhancesperformance and increases both hardware and software stability. A highlyflexible back plane provides support to peripherals and verticalapplications. Other implementations of the present invention embrace theuse of a durable and dynamically modular processing unit that is greaterthan or less than a 3½-inch cube platform. Similarly, otherimplementations embrace the use of shapes other than a cube.

Implementation of the present invention provides a platform that may beemployed in association with all types of computer enterprises. Theplatform allows for a plethora of modifications that may be made withminimal impact to the dynamically modular unit, thereby enhancing theusefulness of the platform across all type of applications.

While the methods and processes of the present invention have proven tobe particularly useful in the area of personal computing enterprises,those skilled in the art will appreciate that the methods and processesof the present invention can be used in a variety of differentapplications and in a variety of different areas of manufacture to yieldcustomizable enterprises, including enterprises for any industryutilizing control systems or smart-interface systems and/or enterprisesthat benefit from the implementation of such devices. Examples of suchindustries include, but are not limited to, automotive industries,avionic industries, hydraulic control industries, auto/video controlindustries, telecommunications industries, medical industries, specialapplication industries, and electronic consumer device industries.Accordingly, the systems and methods of the present invention providemassive computing power to markets, including markets that havetraditionally been untapped by current computer techniques.

These and other features and advantages of the present invention will beset forth or will become more fully apparent in the description thatfollows. The features and advantages may be realized and obtained bymeans of the instruments and combinations provided herein. Furthermore,the features and advantages of the invention may be learned by thepractice of the invention or will be obvious from the description, asset forth hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to set forth the manner in which the above recited and otherfeatures and advantages of the present invention are obtained, a moreparticular description of the invention will be rendered by reference tospecific embodiments thereof, which are illustrated in the appendeddrawings. Understanding that the drawings depict only typicalembodiments of the present invention and are not, therefore, to beconsidered as limiting the scope of the invention, the present inventionwill be described and explained with additional specificity and detailthrough the use of the accompanying drawings in which:

FIG. 1 illustrates a block diagram that provides a representativemodular processing unit connected to peripherals to provide arepresentative computing enterprise in accordance with the presentinvention;

FIG. 2 illustrates a representative embodiment of a durable anddynamically modular processing unit;

FIG. 3 provides another view of the embodiment of FIG. 2 having anon-peripheral based encasement, a cooling process (e.g., thermodynamicconvection cooling, forced air, and/or liquid cooling), an optimizedlayered printed circuit board configuration, optimized processing andmemory ratios, and a dynamic back plane that provides increasedflexibility and support to peripherals and applications;

FIG. 4 provides a representative enterprise wherein a dynamicallymodular processing unit, having a non-peripheral based encasement, isemployed alone in a personal computing enterprise;

FIG. 5 provides a representative enterprise wherein a dynamicallymodular processing unit, having a non-peripheral based encasement, isemployed in another representative computing enterprise;

FIG. 6 provides another representative enterprise similar to FIG. 5 thatincludes additional peripherals, such as removable drives or othermodular peripherals;

FIG. 7 provides another representative enterprise wherein a dynamicallymodular processing unit is utilized in an electronic enterprise;

FIG. 8 provides another representative enterprise, wherein a dynamicallymodular processing unit is utilized as a handheld enterprise;

FIG. 9 provides a utilization of the embodiment of FIG. 8 in anotherrepresentative enterprise;

FIG. 10 provides another representative handheld enterprise having anon-peripheral based encasement combined with an external flip-up I/Operipheral;

FIG. 11 provides another view of the embodiment of FIG. 10;

FIG. 12 provides a representative enterprise wherein a dynamicallymodular processing unit is employed in a representative consumerelectrical device;

FIG. 13 provides another representative enterprise wherein a dynamicallymodular processing unit is employed in a representative electricaldevice;

FIG. 14 provides a representative enterprise wherein one or moredynamically modular processing units are employed in another electricaldevice;

FIG. 15 provides a representative enterprise wherein one or moredynamically modular processing units are employed in anotherrepresentative device; and

FIG. 16 provides a representative enterprise wherein multipledynamically modular processing units, each having a non-peripheral basedencasement, are oriented and employed in a computing enterprise toprovide increased processing capabilities.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to systems and methods for providing adynamically modular processing unit. In particular, embodiments of thepresent invention take place in association with a modular processingunit that is lightweight, compact, and is configured to be selectivelyused alone or oriented with one or more additional processing units inan enterprise. In some embodiments, a modular processing unit includes anon-peripheral based encasement, a cooling process (e.g., thermodynamicconvection cooling, forced air, and/or liquid cooling), an optimizedlayered printed circuit board configuration, optimized processing andmemory ratios, and a dynamic back plane that provides increasedflexibility and support to peripherals and applications.

Embodiments of the present invention embrace a platform that may beemployed in association with all types of computer and/or electricalenterprises. The platform allows for a plethora of modifications thatmay be made with minimal impact to the dynamic modular unit, therebyenhancing the usefulness of the platform across all types ofapplications. Moreover, as indicated above, the modular processing unitmay function alone or may be associated with one or more other modularprocessing units in a customizable enterprise to provide enhancedprocessing capabilities.

FIG. 1 and the corresponding discussion are intended to provide ageneral description of a suitable operating environment in accordancewith embodiments of the present invention. As will be further discussedbelow, embodiments of the present invention embrace the use of one ormore dynamically modular processing units in a variety of customizableenterprise configurations, including in a networked or combinationconfiguration, as will be discussed below.

Embodiments of the present invention embrace one or more computerreadable media, wherein each medium may be configured to include orincludes thereon data or computer executable instructions formanipulating data. The computer executable instructions include datastructures, objects, programs, routines, or other program modules thatmay be accessed by one or more processors, such as one associated with ageneral-purpose modular processing unit capable of performing variousdifferent functions or one associated with a special-purpose modularprocessing unit capable of performing a limited number of functions.

Computer executable instructions cause the one or more processors of theenterprise to perform a particular function or group of functions andare examples of program code means for implementing steps for methods ofprocessing. Furthermore, a particular sequence of the executableinstructions provides an example of corresponding acts that may be usedto implement such steps.

Examples of computer readable media include random-access memory(“RAM”), read-only memory (“ROM”), programmable read-only memory(“PROM”), erasable programmable read-only memory (“EPROM”), electricallyerasable programmable read-only memory (“EEPROM”), compact diskread-only memory (“CD-ROM”), any solid state storage device (e.g., flashmemory, smart media, etc.), or any other device or component that iscapable of providing data or executable instructions that may beaccessed by a processing unit.

With reference to FIG. 1, a representative enterprise includes modularprocessing unit 10, which may be used as a general-purpose orspecial-purpose processing unit. For example, modular processing unit 10may be employed alone or with one or more similar modular processingunits as a personal computer, a notebook computer, a personal digitalassistant (“PDA”) or other hand-held device, a workstation, aminicomputer, a mainframe, a supercomputer, a multi-processor system, anetwork computer, a processor-based consumer device, a smart applianceor device, a control system, or the like. Using multiple processingunits in the same enterprise provides increased processing capabilities.For example, each processing unit of an enterprise can be dedicated to aparticular task or can jointly participate in distributed processing.

In FIG. 1, modular processing unit 10 includes one or more buses and/orinterconnect(s) 12, which may be configured to connect variouscomponents thereof and enables data to be exchanged between two or morecomponents. Bus(es)/interconnect(s) 12 may include one of a variety ofbus structures including a memory bus, a peripheral bus, or a local busthat uses any of a variety of bus architectures. Typical componentsconnected by bus(es)/interconnect(s) 12 include one or more processors14 and one or more memories 16. Other components may be selectivelyconnected to bus(es)/interconnect(s) 12 through the use of logic, one ormore systems, one or more subsystems and/or one or more I/O interfaces,hereafter referred to as “data manipulating system(s) 18.” Moreover,other components may be externally connected to bus(es)/interconnect(s)12 through the use of logic, one or more systems, one or more subsystemsand/or one or more I/O interfaces, and/or may function as logic, one ormore systems, one or more subsystems and/or one or more I/O interfaces,such as modular processing unit(s) 30 and/or proprietary device(s) 34.Examples of I/O interfaces include one or more mass storage deviceinterfaces, one or more input interfaces, one or more output interfaces,and the like. Accordingly, embodiments of the present invention embracethe ability to use one or more I/O interfaces and/or the ability tochange the usability of a product based on the logic or other datamanipulating system employed.

The logic may be tied to an interface, part of a system, subsystemand/or used to perform a specific task. Accordingly, the logic or otherdata manipulating system may allow, for example, for IEEE1394(firewire), wherein the logic or other data manipulating system is anI/O interface. Alternatively or additionally, logic or another datamanipulating system may be used that allows a modular processing unit tobe tied into another external system or subsystem. For example, anexternal system or subsystem that may or may not include a special I/Oconnection. Alternatively or additionally, logic or other datamanipulating system may be used wherein no external I/O is associatedwith the logic. Embodiments of the present invention also embrace theuse of specialty logic, such as for ECUs for vehicles, hydraulic controlsystems, etc. and/or logic that informs a processor how to control aspecific piece of hardware. Moreover, those skilled in the art willappreciate that embodiments of the present invention embrace a plethoraof different systems and/or configurations that utilize logic, systems,subsystems and/or I/O interfaces.

As provided above, embodiments of the present invention embrace theability to use one or more I/O interfaces and/or the ability to changethe usability of a product based on the logic or other data manipulatingsystem employed. For example, where a modular processing unit is part ofa personal computing system that includes one or more I/O interfaces andlogic designed for use as a desktop computer, the logic or other datamanipulating system may be changed to include flash memory or logic toperform audio encoding for a music station that wants to take analogaudio via two standard RCAs and broadcast them to an IP address.Accordingly, the modular processing unit may be part of a system that isused as an appliance rather than a computer system due to a modificationmade to the data manipulating system(s) (e.g., logic, system, subsystem,I/O interface(s), etc.) on the back plane of the modular processingunit. Thus, a modification of the data manipulating system(s) on theback plane can change the application of the modular processing unit.Accordingly, embodiments of the present invention embrace very adaptablemodular processing units.

As provided above, processing unit 10 includes one or more processors14, such as a central processor and optionally one or more otherprocessors designed to perform a particular function or task. It istypically processor 14 that executes the instructions provided oncomputer readable media, such as on memory(ies) 16, a magnetic harddisk, a removable magnetic disk, a magnetic cassette, an optical disk,or from a communication connection, which may also be viewed as acomputer readable medium.

Memory(ies) 16 includes one or more computer readable media that may beconfigured to include or includes thereon data or instructions formanipulating data, and may be accessed by processor(s) 14 throughbus(es)/interconnect(s) 12. Memory(ies) 16 may include, for example,ROM(s) 20, used to permanently store information, and/or RAM(s) 22, usedto temporarily store information. ROM(s) 20 may include a basicinput/output system (“BIOS”) having one or more routines that are usedto establish communication, such as during start-up of modularprocessing unit 10. During operation, RAM(s) 22 may include one or moreprogram modules, such as one or more operating systems, applicationprograms, and/or program data.

As illustrated, at least some embodiments of the present inventionembrace a non-peripheral encasement, which provides a more robustprocessing unit that enables use of the unit in a variety of differentapplications. In FIG. 1, one or more mass storage device interfaces(illustrated as data manipulating system(s) 18) may be used to connectone or more mass storage devices 24 to bus(es)/interconnect(s) 12. Themass storage devices 24 are peripheral to modular processing unit 10 andallow modular processing unit 10 to retain large amounts of data.Examples of mass storage devices include hard disk drives, magnetic diskdrives, tape drives and optical disk drives.

A mass storage device 24 may read from and/or write to a magnetic harddisk, a removable magnetic disk, a magnetic cassette, an optical disk,or another computer readable medium. Mass storage devices 24 and theircorresponding computer readable media provide nonvolatile storage ofdata and/or executable instructions that may include one or more programmodules, such as an operating system, one or more application programs,other program modules, or program data. Such executable instructions areexamples of program code means for implementing steps for methodsdisclosed herein.

Data manipulating system(s) 18 may be employed to enable data and/orinstructions to be exchanged with modular processing unit 10 through oneor more corresponding peripheral I/O devices 26. Examples of peripheralI/O devices 26 include input devices such as a keyboard and/or alternateinput devices, such as a mouse, trackball, light pen, stylus, or otherpointing device, a microphone, a joystick, a game pad, a satellite dish,a scanner, a camcorder, a digital camera, a sensor, and the like, and/oroutput devices such as a monitor or display screen, a speaker, aprinter, a control system, and the like. Similarly, examples of datamanipulating system(s) 18 coupled with specialized logic that may beused to connect the peripheral I/O devices 26 to bus(es)/interconnect(s)12 include a serial port, a parallel port, a game port, a universalserial bus (“USB”), a firewire (IEEE 1394), a wireless receiver, a videoadapter, an audio adapter, a parallel port, a wireless transmitter, anyparallel or serialized I/O peripherals or another interface.

Data manipulating system(s) 18 enable an exchange of information acrossone or more network interfaces 28. Examples of network interfaces 28include a connection that enables information to be exchanged betweenprocessing units, a network adapter for connection to a local areanetwork (“LAN”) or a modem, a wireless link, or another adapter forconnection to a wide area network (“WAN”), such as the Internet. Networkinterface 28 may be incorporated with or peripheral to modularprocessing unit 10, and may be associated with a LAN, a wirelessnetwork, a WAN and/or any connection between processing units.

Data manipulating system(s) 18 enable modular processing unit 10 toexchange information with one or more other local or remote modularprocessing units 30 or computer devices. A connection between modularprocessing unit 10 and modular processing unit 30 may include hardwiredand/or wireless links. Accordingly, embodiments of the present inventionembrace direct bus-to-bus connections. This enables the creation of alarge bus system. It also eliminates hacking as currently known due todirect bus-to-bus connections of an enterprise. Furthermore, datamanipulating system(s) 18 enable modular processing unit 10 to exchangeinformation with one or more proprietary I/O connections 32 and/or oneor more proprietary devices 34.

Program modules or portions thereof that are accessible to theprocessing unit may be stored in a remote memory storage device.Furthermore, in a networked system or combined configuration, modularprocessing unit 10 may participate in a distributed computingenvironment where functions or tasks are performed by a plurality ofprocessing units. Alternatively, each processing unit of a combinedconfiguration/enterprise may be dedicated to a particular task. Thus,for example, one processing unit of an enterprise may be dedicated tovideo data, thereby replacing a traditional video card, and providesincreased processing capabilities for performing such tasks overtraditional techniques.

While those skilled in the art will appreciate that embodiments of thepresent invention may comprise a variety of configurations, reference ismade to FIG. 2, which illustrates a representative embodiment of adurable and dynamically modular processing unit. In the illustratedembodiment of FIG. 2, processing unit 40 is durable and dynamicallymodular. In the illustrated embodiment, unit 40 is a 3½-inch (8.9 cm)cube platform that utilizes an advanced thermodynamic cooling model,eliminating any need for a cooling fan.

However, as provided herein, embodiments of the present inventionembrace the use of other cooling processes in addition to or in place ofa thermodynamic cooling process, such as a forced air cooling processand/or a liquid cooling process. Moreover, while the illustratedembodiment includes a 3½-inch cube platform, those skilled in the artwill appreciate that embodiments of the present invention embrace theuse of a modular processing unit that is greater than or less than a3½-inch cube platform. Similarly, other embodiments embrace the use ofshapes other than a cube.

Processing unit 40 also includes a layered motherboard configuration,that optimizes processing and memory ratios, and a bus architecture thatenhances performance and increases both hardware and software stability,each of which will be further discussed below. Those skilled in the artwill appreciate that other embodiments of the present invention alsoembrace non-layered motherboards. Moreover, other embodiments of thepresent invention embrace embedded motherboard configurations, whereincomponents of the motherboard are embedded into one or more materialsthat provide an insulation between components and embed the componentsinto the one or more materials, and wherein one or more of themotherboard components are mechanical, optical, electrical orelectro-mechanical. Furthermore, at least some of the embodiments ofembedded motherboard configurations include mechanical, optical,electrical and/or electro-mechanical components that are fixed into athree-dimensional, sterile environment. Examples of such materialsinclude polymers, rubbers, epoxies, and/or any non-conducting embeddingcompound(s).

Embodiments of the present invention embrace providing processingversatility. For example, in accordance with at least some embodimentsof the present invention, processing burdens are identified and thensolved by selectively dedicating and/or allocating processing power. Forexample, a particular system is defined according to specific needs,such that dedication or allocation of processing power is controlled.Thus, one or more modular processing units may be dedicated to provideprocessing power to such specific needs (e.g., video, audio, one or moresystems, one or more subsystems, etc.). In some embodiments, being ableto provide processing power decreases the load on a central unit.Accordingly, processing power is driven to the areas needed.

While the illustrated embodiment, processing unit 40 includes a 2 HGzprocessor and 1.5 GB of RAM, those skilled in the art will appreciatethat other embodiments of the present invention embrace the use of afaster or slower processor and/or more or less RAM. In at least someembodiments of the present invention, the speed of the processor and theamount of RAM of a processing unit depends on the nature for which theprocessing unit is to be used.

A highly dynamic, customizable, and interchangeable back plane 44provides support to peripherals and vertical applications. In theillustrated embodiment, back plane 44 is selectively coupled toencasement 42 and may include one or more features, interfaces,capabilities, logic and/or components that allow unit 40 to bedynamically customizable. In the illustrated embodiment, back plane 44includes DVI Video port 46, Ethernet port 48, USB ports 50 (50 a and 50b), SATA bus ports 52 (52 a and 52 b), power button 54, and power port56. Back plane 44 may also include a mechanism that electrically couplestwo or more modular processing units together to increase the processingcapabilities of the entire system as indicated above, and to providescaled processing as will be further disclosed below.

Those skilled in the art will appreciate that back plane 44 with itscorresponding features, interfaces, capabilities, logic and/orcomponents are representative only and that embodiments of the presentinvention embrace back planes having a variety of different features,interfaces, capabilities and/or components. Accordingly, a processingunit is dynamically customizable by allowing one back plane to bereplaced by another back plane in order to allow a user to selectivelymodify the logic, features and/or capabilities of the processing unit.

Moreover, embodiments of the present invention embrace any number and/ortype of logic and/or connectors to allow use of one or more modularprocessing units 40 in a variety of different environments. For example,the environments include vehicles (e.g., cars, trucks, motorcycles,etc.), hydraulic control systems, and other environments. The changingof data manipulating system(s) on the back plane allows for scalingvertically and/or horizontally for a variety of environments, as will befurther discussed below.

Furthermore, embodiments of the present invention embrace a variety ofshapes and sizes of modular processing units. For example, in FIG. 2modular processing unit 40 is a cube that is smaller than traditionalprocessing units for a variety of reasons.

As will be appreciated by those skilled in the art, embodiments of thepresent invention are easier to support than traditional techniquesbecause of, for example, materials used, the size and/or shape, the typeof logic and/or an elimination of a peripherals-based encasement.

In the illustrated embodiment, power button 54 includes three states,namely on, off and standby for power boot. When the power is turned onand received, unit 40 is instructed to load and boot an operating systemsupported in memory. When the power is turned off, processing controlunit 40 will interrupt any ongoing processing and begin a shut downsequence that is followed by a standby state, wherein the system waitsfor the power on state to be activated.

USB ports 50 are configured to connect peripheral input/output devicesto processing unit 40. Examples of such input or output devices includea keyboard, a mouse or trackball, a monitor, printer, another processingunit or computer device, a modem, and a camera.

SATA bus ports 52 are configured to electronically couple and supportmass storage devices that are peripheral to processing unit 40. Examplesof such mass storage devices include floppy disk drives, CD-ROM drives,hard drives, tape drives, and the like.

As provided above, other embodiments of the present invention embracethe use of additional ports and means for connecting peripheral devices,as will be appreciated by one of ordinary skill in the art. Therefore,the particular ports and means for connecting specifically identifiedand described herein are intended to be illustrative only and notlimiting in any way.

As provided herein, a variety of advantages exist through the use of anon-peripheral processing unit over larger, peripheral packed computerunits. By way of example, the user is able to selectively reduce thespace required to accommodate the enterprise, and may still provideincreased processing power by adding processing units to the systemwhile still requiring less overall space. Moreover, since each of theprocessing units includes solid-state components rather than systemsthat are prone to breaking down, the individual units may be hidden(e.g., in a wall, in furniture, in a closet, in a decorative device suchas a clock).

The durability of the individual processing units/cubes allowsprocessing to take place in locations that were otherwise unthinkablewith traditional techniques. For example, the processing units can beburied in the earth, located in water, buried in the sea, placed on theheads of drill bits that drive hundreds of feet into the earth, onunstable surfaces in furniture, etc. The potential processing locationsare endless. Other advantages include a reduction in noise and heat, anability to provide customizable “smart” technology into various devicesavailable to consumers, such as furniture, fixtures, vehicles,structures, supports, appliances, equipment, personal items, etc.

With reference now to FIG. 3, another view of the embodiment of FIG. 2is provided, wherein the view illustrates processing unit 40 with theside walls of the cube removed to more fully illustrate thenon-peripheral based encasement, cooling process (e.g., thermodynamicconvection cooling, forced air, and/or liquid cooling), optimizedlayered circuit board configuration, and dynamic back plane. In theillustrated embodiment, the various boards are coupled together by usinga force fit technique, which prevents accidental decoupling of theboards and enables interchangeability. The boards provide for anenhanced EMI distribution and/or chip/logic placement. Those skilled inthe art will appreciate that embodiments of the present inventionembrace any number of boards and/or configurations. Furthermore, boardstructures may be modified for a particular benefit and/or need based onone or more applications and/or features. In FIG. 3, processing unit 40includes a layered circuit board/motherboard configuration 60 thatincludes two parallel sideboards 62 (62 a and 62 b) and a central board64 transverse to and electronically coupling sideboards 62. While theillustrated embodiment provides a tri-board configuration, those skilledin the art will appreciate that embodiments of the present inventionembrace board configurations having less than three boards, and layeredboard configurations having more than three boards. Moreover,embodiments of the present invention embrace other configurations ofcircuit boards, other than boards being at right angles to each other.

In the illustrated embodiment, the layered motherboard 60 is supportedwithin encasement 42 using means for coupling motherboard 60 toencasement 42. In the illustrated embodiment, the means for couplingmotherboard 60 to encasement 42 include a variety of channeled slotsthat are configured to selectively receive at least a portion ofmotherboard 60 and to hold motherboard 60 in position. As upgrades arenecessary with the advancing technology, such as when processor 66 is tobe replaced with an improved processor, the corresponding board (e.g.,central board 64) is removed from the encasement 42 and a new board witha new processor is inserted to enable the upgrade. Accordingly,embodiments of the present invention have proven to facilitate upgradesas necessary and to provide a customizable and dynamic processing unit.

Processing unit 40 also includes one or more processors that at areconfigured to perform one or more tasks. In FIG. 3, the one or moreprocessors are illustrated as processor 66, which is coupled to centralboard 64. As technology advances, there may be a time when the user ofprocessing unit 40 will want to replace processor 66 with an upgradedprocessor. Accordingly, central board 64 may be removed from encasement42 and a new central board having an upgraded processor may be installedand used in association with unit 40. Accordingly, embodiments of thepresent invention embrace dynamically customizable processing units thatare easily upgraded and thus provide a platform having longevity incontrast to traditional techniques.

With reference now to FIG. 4, a representative enterprise 70 isillustrated, wherein a dynamically modular processing unit 40 having anon-peripheral based encasement, is employed alone in a personalcomputing enterprise. In the illustrated embodiment, processing unit 40includes power connection 71 and employs wireless technology with theperipheral devices of enterprise 70. The peripheral devices includemonitor 72 having hard disk drive 74, speakers 76, and CD ROM drive 78,keyboard 80 and mouse 82. Those skilled in the art will appreciate thatembodiments of the present invention also embrace personal computingenterprises that employ technologies other than wireless technologies.

Processing unit 40 is the driving force of enterprise 70 since itprovides the processing power to manipulate data in order to performtasks. The dynamic and customizable nature of the present inventionallows a user to easily augment processing power. In the presentembodiment, processing unit 40 is a 3½-inch (8.9 cm) cube that utilizesthermodynamic cooling and optimizes processing and memory ratios.However, as provided herein, embodiments of the present inventionembrace the use of other cooling processes in addition to or in place ofa thermodynamic cooling process, such as a forced air cooling processand/or a liquid cooling process. Furthermore, while the illustratedembodiment includes a 3½-inch cube platform, those skilled in the artwill appreciate that embodiments of the present invention embrace theuse of a modular processing unit that is greater than or less than a3½-inch cube platform. Similarly, other embodiments embrace the use ofshapes other than a cube.

In particular, processing unit 40 of the illustrated embodiment includesa 2 GHz processor, 1.5 G RAM, a 512 L2 cache, and wireless networkinginterfaces. So, for example, should the user of enterprise 70 determinethat increased processing power is desired for enterprise 70, ratherthan having to purchase a new system as is required by some traditionaltechnologies, the user may simply add one or more modular processingunits to enterprise 70. The processing units/cubes may be selectivelyallocated by the user as desired for performing processing. For example,the processing units may be employed to perform distributive processing,each unit may be allocated for performing a particular task (e.g., oneunit may be dedicated for processing video data, or another task), orthe modular units may function together as one processing unit.

While the present example includes a processing unit that includes a 2GHz processor, 1.5 G RAM, and a 512 L2 cache, those skilled in the artwill appreciate that other embodiments of the present invention embracethe use of a faster or slower processor, more or less RAM, and/or adifferent cache. In at least some embodiments of the present invention,the capabilities of the processing unit depends on the nature for whichthe processing unit will be used.

While FIG. 4 illustrates processing unit 40 on top of the illustrateddesk, the robust nature of the processing unit/cube allows for unit 40to alternatively be placed in a non-conspicuous place, such as in awall, mounted underneath the desk, in an ornamental device or object,etc. Accordingly, the illustrated embodiment eliminates traditionaltowers that tend to be kicked and that tend to produce sound from thecooling system inside of the tower. No sound is emitted from unit 40 asall internal components are solid states when convection cooling orliquid cooling is employed.

With reference now to FIG. 5, another example is provided for utilizinga modular processing unit in a computing enterprise. In FIG. 5, anability of modular processing unit 40 to function as a load-bearingmember is illustrated. For example, a modular processing unit may beused to bridge two or more structures together and to contribute to theoverall structural support and stability of the structure or enterprise.In addition, a modular processing unit may bear a load attached directlyto a primary support body. For example, a computer screen or monitor maybe physically supported and the processing controlled by a modularprocessing unit. In the illustrated embodiment, monitor 90 is mounted tomodular processing unit 40, which is in turn mounted to a stand 92having a base 94.

With reference now to FIG. 6, another representative enterprise isillustrated, wherein a dynamically modular processing unit 40 having anon-peripheral based encasement, is employed computing enterprise. InFIG. 6, the representative enterprise is similar to the embodimentillustrated in FIG. 5, however one or more modular peripherals areselectively coupled to the enterprise. In particular, FIG. 6 illustratesmass storage devices 93 that are selectively coupled to the enterpriseas peripherals. Those skilled in the art will appreciate that any number(e.g., less than two or more than two) and/or type of peripherals may beemployed. Examples of such peripherals include mass storage devices, I/Odevices, network interfaces, other modular processing units, proprietaryI/O connections; proprietary devices, and the like.

With reference now to FIG. 7, another representative embodiment isillustrated, wherein a dynamically modular processing unit 40 having anon-peripheral based encasement, is employed in an enterprise. Inaccordance with at least some embodiments of the present invention, amodular processing unit having a non-peripheral based encasement may beemployed in a central processing unit or in other electronic devices,including a television, a stereo system, a recording unit, a set topbox, or any other electronic device. Accordingly, the modular processingunit may be selectively used to in the enterprise to monitor, warn,inform, control, supervise, record, recognize, etc. In FIG. 7, modularprocessing unit is coupled to a power source 94, one or more otherperipherals 95, and connections 96 for use in the enterprise.

As provided herein, embodiments of the present invention embrace avariety of shapes and sizes for a modular processing unit. Withreference now to FIG. 8, a modular processing unit 40 is illustratedthat is employed as a hand-held computing enterprise, such as a personaldigital assistant (“PDA”). An I/O peripheral 97 is coupled to themodular processing unit 40. In the illustrated embodiment, the I/Operipheral 97 includes a monitor and a stylus to enable input andoutput. Those skilled in the art will appreciate that additionalperipherals may be included, such as speakers, a microphone, a cellulartelephone, keyboard, or any other type of peripheral, representativeexamples of such will be provided below.

In the embodiment of FIG. 8, the hand-held computing enterprise has thedimensions of 3.5″×4.75″×0.75″, however those skilled in the art willappreciate that the present invention also embraces embodiments that arelarger or smaller than the illustrated embodiment. In FIG. 8, the I/Operipheral 97 is a slide on pieces that is selectively coupled tomodular processing unit 40, which includes a non-layered board design toallow unit 40 to be more slender. Additional peripherals include a powersource and mass storage device. In one embodiment, the mass storagedevice is a 40 G hard drive that enables the user to always have all ofhis/her files. Accordingly, the embodiment of FIG. 8 enables a user toemploy a complete computer in the palm of his/her hand. Moreover,because of the solid state components, the embodiment of FIG. 8 is moredurable than traditional techniques. Furthermore, in at least someembodiments, the casing includes metal to increase the durability.Accordingly, if unit 40 is dropped, the core will not be broken.

With reference now to FIG. 9, another representative enterprise isillustrated that includes a dynamically modular processing unit 40having a non-peripheral based encasement. In FIG. 9, processing unit 40,having an I/O peripheral 97, is selectively coupled to peripheral 98 toallow the representative enterprise to function as a high-end laptopcomputer. Utilizing a liquid cooling technique, for example, processingunit 40 can be a very powerful handheld machine. And, as illustrated inFIG. 9, unit 40 may be selectively inserted like a cartridge into alarge I/O peripheral 98, which includes a keyboard, monitor, speakers,and optionally logic depending on end user application. Once unit 40 isdecoupled/ejected from peripheral 98, unit 40 can retain the files toallow the user to always have his/her files therewith. Accordingly,there is no need to synchronize unit 40 with peripheral 98 since unit 40includes all of the files. While the embodiment illustrated in FIG. 9includes one modular processing unit, other embodiments of the presentinvention embrace the utilization of multiple processing units.

Similarly, modular processing unit 40 may be inserted or otherwisecoupled to a variety of other types of peripherals, including anenterprise in a vehicle, at home, at the office, or the like. Unit 40may be used to preserve and provide music, movies, pictures or any otheraudio and/or video.

With reference now to FIGS. 10-11, another representative enterprise isillustrated, wherein a dynamically modular processing unit 40 having anon-peripheral based encasement, is employed in a personal computingenterprise. In FIGS. 10-11, modular processing unit 40 is coupled to aflip top peripheral 99, which includes a monitor, thumb keyboard andmouse device. The flip top peripheral 99 runs at full speeds with a handtop computer to do spreadsheets, surf the internet, and other functionsand/or tasks. The embodiment illustrated in FIGS. 10-11 boots a fullversion of an operating system when the flip top is open. In anotherembodiment, flip top peripheral 99 and I/O peripheral 97 (FIG. 8) aresimultaneously coupled to the same modular processing device such thatthe enterprise boots a full version of an operating system when the fliptop is open and runs a modified version when closed that operates onminimal power and processing power.

In further embodiments, modular processing units are employed as MP3players and/or video players. In other embodiments, a camera is employedas a peripheral and the images/video are preserved on the modularprocessing unit.

As provided above, embodiments of the present invention are extremelyversatile. As further examples, processing control unit 40 may be usedto physically support and/or provide processing to various fixtures ordevices, such a lighting fixture (FIG. 12), an electrical outlet (FIG.13), or a breaker box (FIG. 14). As provided herein, at least someembodiments of the present invention embrace a modular processing unitthat functions as an engine that drives and controls the operation of avariety of components, structures, assemblies, equipment modules, etc.

With reference now to FIG. 12, a representative enterprise isillustrated wherein a dynamically modular processing unit is employed ina representative consumer electrical device. In FIG. 12, modularprocessing unit 40 is incorporated a lighting fixture 100. For example,modular processing unit 40 may be used to control the on/off, dimming,and other attributes of lighting fixture 100, such as monitoring thewattage used by the bulb and alerting a control center of anymaintenance required for lighting fixture 100 or any other desirableinformation. In the illustrated embodiment, modular processing unit 40is mounted to a ceiling structure via slide-on mounting bracket 102 andto lighting fixture 100 using a mounting bracket slide-on lightingmodule 104 that is slid into slide receivers (not shown) located in theprimary support body of modular processing unit 40. Lighting module 104may support one or more light bulbs and a cover as shown. In theillustrated embodiment, modular processing unit 40 is also mounted to aslide on dimmer 194.

With reference to FIG. 13, a representative enterprise is illustrated,wherein a dynamically modular processing unit 40 having a non-peripheralbased encasement is employed in another representative electricaldevice, wherein the representative device is an electrical outlet orplug that is used for 802.11x distribution. In FIG. 13, modularprocessing unit 40 is coupled to an AC interface 107, AC plug peripheral108, and mounting bracket 109. AC plug peripheral 108 and mountingbracket 109 are slide-on peripherals. Modular processing unit 40 ispowered by the ac distribution into unit 40 and is used as a smart plugto monitor, control, oversee, and/or allocate power distribution.

In one embodiment, unit 40 is utilized as a router. In anotherembodiment, unit 40 is employed as a security system. In anotherembodiment, unit 40 monitors electrical distribution and disconnectspower as needed to ensure safety. For example, unit 40 is able to detectis an individual has come in contact with the electrical distributionand automatically shuts off the power. In some embodiments,technologies, such as X10 based technologies or other technologies, areused to connect multiple enterprises, such as the one illustrated inFIG. 13, over copper wire lines. In further embodiments, the multipleenterprises exchange data over, for example, a TCP/IP or other protocol.

Accordingly, embodiments of the present invention embrace theutilization of a modular processing unit in association with a mundaneproduct to form a smart product. Although not exhaustive, other examplesof products, systems and devices with a modular processing unit may beused to provide a smart product, system and/or device include a heatingsystem, a cooling system, a water distribution system, a powerdistribution system, furniture, fixtures, equipment, gears, drills,tools, buildings, artificial intelligence, vehicles, sensors, videoand/or audio systems, security systems, and many more products, systemsand/or devices.

For example, a modular processing unit in association with a furnace maybe used to control the efficiency of the furnace system. If theefficiency decreases, the modular processing unit may be programmed toprovide the owner of the building, for example in an emailcommunication, to change filters, service the system, identify afailure, or the like. Similarly, a modular processing unit may be usedin association with a water supply to monitor the purity of the waterand provide a warning in the event of contamination. Similarly,appliances (e.g., washers, dryers, dishwashers, refrigerators, and thelike) may be made smart when used in association with a modularprocessing unit. Furthermore, the modular processing units may be usedin association with a system that provides security, including detectingcarbon monoxide, anthrax or other biological agents, radiologicalagents, or another agent or harmful substance. Moreover, due to thestability and versatility of the processing units, the modularprocessing units may be placed in locations previously unavailable. Inat least some embodiments, the use of a modular processing unit with asuper structure allows the modular processing unit to take on qualitiesof the super structure.

With reference now to FIG. 14, a representative enterprise isillustrated wherein one or more dynamically modular processing units areemployed in another representative device, namely a voltage monitoringbreaker box. In the illustrated embodiment, modular processing units 40are used to transform a standard breaker box 114 into a voltagemonitoring breaker box 110. Dual redundant modular processing units 40function to process control breaker box 110 and monitor the voltage, inreal-time, existing within breaker box 110 and throughout the house.Attached to each modular processing unit 40 is a voltage monitoring backplate 112, which attach using slide receivers. While the illustratedembodiment provides two modular processing units, those skilled in theart will appreciate that other embodiments embrace the use of onemodular processing units or more than two processing units.

With reference now to FIG. 15, another representative enterprise isillustrated wherein one or more dynamically modular processing units areemployed in a representative device. In FIG. 15, modular processingunits 40 are used in a load-bearing configuration of a table assembly120, which employs slide-on leg mounts 122 that couple to respectiveslide receivers on corresponding modular processing units 40 to comprisethe legs of table assembly 120. In the illustrated configuration, aplurality of modular processing units 40 is physically andelectronically coupled together, and comprises the primary physicalstructure of table assembly 120. Also shown is a slide-on DVD and harddrive module 124 that allow table assembly 120 to perform certainfunctions. Also illustrated is a plurality of modular processing unitbearing connectors 126.

These illustrations are merely exemplary of the capabilities of one ormore modular processing units in accordance with embodiments of thepresent invention. Indeed, one of ordinary skill in the art willappreciate that embodiments of the present invention embrace many otherconfigurations, environments, and set-ups, all of which are intended tobe within the scope of embodiments of the present invention.

As provided herein, the dynamic and modular nature of the processingunits allow for one or more processing units that may be used with alltypes of enterprises. With reference now to FIG. 16, enterprise 130 is aserver array that is configured for server clustering and includesmultiple dynamically modular processing units 132, each having anon-peripheral based encasement, which are housed in cabinet 134 and areavailable for use in processing data. In the illustrated embodiment,cabinet 134 includes drawers that receive modular processing units 132.Enterprise 130 further includes mass storage devices 136 for preservingdata.

While FIG. 16 illustrates a cabinet that includes drawers configured toreceive the individual processing units/cube, other embodiments of thepresent invention include the use of a mounting bracket that may be usedin association with a processing unit/cube to mount the unit/cube onto abar. The illustrated embodiment further includes a cooling system (notshown) that allows for temperature control inside of cabinet 134, andutilizes vents 138.

The modular nature of the processing units/cubes is illustrated by theuse of the processing units in the various representative enterprisesillustrated. Embodiments of the present invention embrace chaining theunits/cubes in a copper and/or fiber channel design, coupling the cubesin either series or parallel, designating individual cubes to performparticular processing tasks, and other processing configurations and/orallocations.

Each unit/cube includes a completely re-configurable motherboard. In oneembodiment, the one or more processors are located on the back plane ofthe motherboard and the RAM modules are located on planes that aretransverse to the back plane of the motherboard. In a furtherembodiment, the modules are coupled right to the board rather than usingtraditional sockets. The clock cycle of the units are optimized to theRAM modules.

While one method for improving processing powering an enterpriseincludes adding one or more additional processing units/cubes to theenterprise, another method includes replacing planes of the motherboardof a particular unit/cube with planes having upgraded modules.Similarly, the interfaces available at each unit/cube may be updated byselectively replacing a panel of the unit/cube. Moreover, a 32-bit buscan be upgraded to a 64-bit bus, new functionality can be provided, newports can be provided, a power pack sub system can be provided/upgraded,and other such modifications, upgrades and enhancements may be made toindividual processing units/cubes by replacing one or more panels.

Thus, as discussed herein, embodiments of the present invention embracesystems and methods for providing a dynamically modular processing unit.In particular, embodiments of the present invention relate to providinga modular processing unit that is configured to be selectively orientedwith one or more additional units in an enterprise. In at least someembodiments, a modular processing unit includes a non-peripheral basedencasement, a cooling process (e.g., a thermodynamic convection coolingprocess, a forced air cooling process, and/or a liquid cooling process),an optimized layered printed circuit board configuration, optimizedprocessing and memory ratios, and a dynamic back plane that providesincreased flexibility and support to peripherals and applications.

The present invention may be embodied in other specific forms withoutdeparting from its spirit or essential characteristics. The describedembodiments are to be considered in all respects only as illustrativeand not restrictive. The present invention may be embodied in otherspecific forms without departing from its spirit or essentialcharacteristics. The described embodiments are to be considered in allrespects only as illustrative and not restrictive. The scope of theinvention is, therefore, indicated by the appended claims rather than bythe foregoing description. All changes that come within the meaning andrange of equivalency of the claims are to be embraced within theirscope.

1. (canceled)
 2. (canceled)
 3. (canceled)
 4. (canceled)
 5. (canceled) 6.A dynamic modular processing system, comprising: a processing unithaving a non-peripheral based encasement and a coupling interface; afirst peripheral module configured to interchangeably couple to thecoupling interface; and a second peripheral module configured tointerchangeably couple to the coupling interface following removal ofthe first peripheral module from the coupling interface.
 7. The systemof claim 6, wherein the processing unit further comprises a processoroperably coupled to an optimized circuit board, and a bus systeminterposedly connected to the coupling interface and the optimizedcircuit board.
 8. The system of claim 6, further comprising a pluralityof peripheral modules each configured to solely and interchangeablycouple to the coupling interface of the processing unit.
 9. The systemof claim 6, further comprising an interchangeable back plane, whereinthe interchangeable back plane couples to a portion of the encasement,and the coupling interface forms a portion of the interchangeablebackplane.
 10. The system of claim 6, wherein the first and secondperipheral modules include at least one of: (i) a mass storage device;(ii) a peripheral input device; (iii) a peripheral output device; (iv) anetwork interface; (v) a second processing unit; (vi) a proprietaryinput connection; (vii) a proprietary output connection; and (viii) aproprietary device.
 11. The system of claim 6, wherein the processingunit is used in conjunction with a peripheral module selected from thegroup consisting of: (i) a personal computer; (ii) a notebook computer;(iii) a personal digital assistant; (iv) a handheld device; (v) aworkstation; (vi) a minicomputer; (vii) a mainframe; (viii) aprocessor-based consumer device; (ix) a smart device; and (x) a controlsystem.
 12. The system of claim 7, wherein the optimized circuit boardis a tri-board electrical printed circuit board.
 13. The system of claim7, wherein the coupled first and second peripheral modules are operablyconnected to the processor via the coupling interface, the bus system,and the optimized circuit board.
 14. The system of claim 7, furthercomprising memory coupled to the bus and within the processing unit. 15.A method for providing a dynamic modular processing system, comprising:providing a processing unit having a non-peripheral based encasement anda coupling interface; providing a first peripheral module configured tointerchangeably couple to the coupling interface; and providing a secondperipheral module configured to interchangeably couple to the couplinginterface following removal of the first peripheral module from thecoupling interface.
 16. The method of claim 15, further comprising:modifying the processing unit to include a processor operably coupled toan optimized circuit board; and operably connecting the couplinginterface to the optimized circuit board via a bus system.
 17. Themethod of claim 15, further comprising operably coupling the first andsecond peripheral modules to the processor via the coupling interface,the bus system, and the optimized circuit board.
 18. The method of claim15, wherein the optimized circuit board is a tri-board electricalprinted circuit board.
 19. The method of claim 15, wherein the first andsecond peripheral modules include at least one of: (i) a mass storagedevice; (ii) a peripheral input device; (iii) a peripheral outputdevice; (iv) a network interface; (v) a second processing unit; (vi) aproprietary input connection; (vii) a proprietary output connection; and(viii) a proprietary device.
 20. The method of claim 15, wherein theprocessing unit is coupled with a peripheral module selected from thegroup consisting of: (i) a personal computer; (ii) a notebook computer;(iii) a personal digital assistant; (iv) a handheld device; (v) aworkstation; (vi) a minicomputer; (vii) a mainframe; (viii) aprocessor-based consumer device; (ix) a smart device; and (x) a controlsystem.
 21. A modular personal computer system, comprising: a processingunit having a non-peripheral based encasement and an externallyaccessible coupling interface; and a peripheral module having aninterface for compatibly and interchangeably coupling to the couplinginterface of the processing unit, wherein the coupling of the processingunit to the peripheral module provides a smart product.
 22. The systemof claim 21, wherein the processing unit further comprises a processoroperably coupled to an optimized circuit board, and a bus systeminterposedly connected to the coupling interface and the optimizedcircuit board.
 23. The system of claim 21, further comprising aplurality of interchangeable peripheral modules.
 24. The system of claim21, wherein the processing unit is coupled with a peripheral moduleselected from the group consisting of: (i) a personal computer; (ii) anotebook computer; (iii) a personal digital assistant; (iv) a handhelddevice; (v) a workstation; (vi) a minicomputer; (vii) a mainframe;(viii) a processor-based consumer device; (ix) a smart device; and (x) acontrol system.
 25. The system of claim 22, wherein the plurality ofperipheral modules includes at least one of: (i) a mass storage device;(ii) a peripheral input device; (iii) a peripheral output device; (iv) anetwork interface; (v) a second processing unit; (vi) a proprietaryinput connection; (vii) a proprietary output connection; and (viii) aproprietary device.